Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
by John H. Lau
John H. Lau presents a focused reference on flip chip, hybrid bonding, fan-in, and fan-out technology. Bringing these related semiconductor packaging approaches together, the book offers readers a concise way to explore the terminology and technology areas shaping modern electronics engineering.
About This Book
Flip chip, hybrid bonding, fan-in, and fan-out are the central subjects of this technical book by John H. Lau.
The volume brings together several semiconductor packaging technologies within one focused reference.
It is suited to readers seeking a broad introduction to these technology areas and their relationship within modern electronics engineering.
Use this book as a starting point for understanding key terminology and major approaches in advanced chip packaging.
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